iPhone 7 Chip Manufacturer Counts Cost of Earthquake Damage

The sole company responsible for manufacturing the processor in Apple’s upcoming iPhone 7 and iPhone 7 Plus has reduced its shipping estimates after its facilities were damaged in an earthquake (via DigiTimes).

Taiwan Semiconductor Manufacturing Company (TSMC) suffered the damage to its plants on February 6 when a 6.4-magnitude quake struck the southern part of the country.

Initially, TSMC reported that the damage incurred would reduce the amount of chips it could ship by less than 1 percent. However, this morning the company revised that estimate and said shipment numbers could be affected over the 1 percent mark, but stopped short of giving a specific number.

Mockup of iPhone 7 case showing flush rear camera and no antenna bands across rear

Despite the earthquake, TSMC stated it is confident of hitting target revenues of $5.9-6.0 billion in the first quarter of 2016. Whether the damage will affect production of the iPhone 7 chip, which is expected to begin in June, remains unclear.

TSMC reached a deal with Apple only last week to become the sole manufacturer for the iPhone 7’s processor, partly thanks to its 10-nanometer manufacturing process. Apple used both Samsung and TSMC to manufacture the chips for the iPhone 6s, perhaps in a bid to lower risks, but the arrangement caused some controversy after benchmarks indicated performance variances between the companies’ processors.

The processor in the iPhone 7 and iPhone 7 Plus is likely called the A10. Both devices are expected to debut in September. Leaks of the phones’ design suggest that it may have a flush rear camera and a lack of antenna bands on its back. Other rumors indicate that the 7 Plus may feature a dual-lens camera system and that it may be waterproof and not have a headphone jack.

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Tags: TSMC, A10
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iPhone 7 Chip Manufacturer Counts Cost of Earthquake Damage

iPhone 7 Predicted to Adopt Lightning Headphones Without Noise-Canceling Capabilities

Apple is likely to wait until 2017 and the „iPhone 7s“ to introduce noise-canceling headphones, according to a Barclays analyst report posted today. In the report, analysts Blayne Curtis and Christopher Hemmelgarn believe that 2016’s iPhone 7 will include a Lightning-equipped headphone accessory, with the „potential“ for a dynamic noise-canceling system to be introduced next year.

The analysts believe Apple will use a basic digital codec in 2016, allowing the company to introduce Lightning-connected headphones later in the year. This move will prepare Apple for the possibility of including Cirrus Logic’s (an Apple audio supplier) more advanced noise-cancellation smart codec in 2017, which requires a digital codec to be installed in the first place.

We still believe there is potential for AAPL to add ANC in the IP7S but believe AAPL is including just the digital headphone in the IP7 this year. Recent speculation surrounding the elimination of the headphone jack in the IP7 is consistent with this move as AAPL will need to provide a digital headset inbox but likely was not willing to spend the extra cost for the ANC functionality.

Rumors surrounding the exclusion of a 3.5mm headphone jack in the iPhone 7 began earlier in the year, although it was unclear whether the accessory would ship in the box or be sold as a separate purchase under the Beats by Dre brand. According to the analysts in today’s report, the 3.5mm headphone jack will be replaced by another speaker thanks to an additional amp also provided by Cirrus Logic.

Other rumors have suggested that Apple is preparing a Bluetooth solution for an upcoming iPhone line, similar in vein to the Bragi Dash headphones, which are finally beginning to ship out to early pre-order customers after over a year of waiting. The headphones would be completely wireless, with two separate pods that require regular charging.

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iPhone 7 Predicted to Adopt Lightning Headphones Without Noise-Canceling Capabilities

Sony’s Dual Camera to See Inclusion in Devices From ‘Major Smartphone Players’

Sony, the manufacturer behind many of the camera sensors used in Apple’s iOS devices, recently confirmed that its dual-lens camera platform will be featured in devices from „major smartphone players“ in 2016. The information was shared by Sony CFO Kenchiro Yoshida during the company’s recent Q3 2015 earnings call and was highlighted by Xperiablog.

Sony’s camera technology is used by a wide range of smartphone manufacturers, including Apple, and Yoshida declined to name specific companies that would take advantage of Sony’s dual-lens camera platform. Dual-lens technology has previously been used in smartphones such as the HTC M8, but it may soon become a more popular option following rumors that Apple plans to incorporate a dual-lens system into its iPhone 7 Plus.

iPhone 7 mockup with dual-lens camera system (Image: Computer Bild)

Apple is said to be planning to use dual-lens technology it acquired from Israeli camera company LinX in the iPhone 7 Plus, but Apple may still be incorporating Sony sensor components into its camera module. Apple is also said to be testing dual-lens camera samples from a range of manufacturers in Taiwan, Japan, and China.

According to Yoshida, dual-lens camera systems will be coming from multiple major smartphone manufacturers this year, but because of slowdowns in the high-end smartphone market could impact production, 2017 will be the year when the dual lens camera platform really takes off.

Well, for next year, our so-called dual lens – dual camera platform will be launched by, we believe, from major smartphone players. However, as I said previously, recently, our smartphone market is growing and particularly, our high-end smartphone market is now slowing down. So, that may impact the demand or production schedule of dual camera smartphones by the major smartphone manufacturers. So, we believe the real start, the takeoff of smartphone with dual lens camera will be in the year of 2017.“

Rumors have suggested Apple is planning to incorporate a dual lens camera system into the iPhone 7 Plus to differentiate it from the iPhone 7, which will continue to offer a more traditional single-lens camera. Should Apple follow through with its plans, its first dual-lens system will debut towards the end of 2016, likely in September.

The launch of the iPhone 7 is still multiple months away, but details about the new device have been steadily trickling out. Yesterday, MacRumors shared information on the device’s design, which is expected to be similar to the iPhone 6s design but with a flush rear camera and no antenna bands across the back. Other rumors suggest it will have improved water resistance and no headphone jack.

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Sony’s Dual Camera to See Inclusion in Devices From ‘Major Smartphone Players’

Leaked ‘iPhone 7’ Display Backlight Shows Moved 3D Touch and Flex Cables

Taiwanese website Apple.club.tw has shared leaked images of the purported backlight assembly for the „iPhone 7“ display. The component draws some similarities to the iPhone 6s and iPhone 6s Plus backlight assembly, although the 3D Touch chip and LCD flex cables are relocated on this leaked part.

Leaked backlight assembly purportedly for „iPhone 7“ display

The website speculates the component could also be for Apple’s next-generation 4-inch iPhone, but previous reports have said the much-rumored „iPhone 6c“ will not have 3D Touch. The pictured size of the 3D Touch chip and flex cables also suggests the backlight assembly is designed for larger than a 4-inch display.

iPhone 6s and iPhone 6s Plus backlight assembly for comparison

Apple.club.tw has accurately leaked or republished multiple Apple products in the past, including the iPhone 6 protruding camera lens, iPhone 6 logic board and iPad Air 2 logic board, but its February 2015 rumor about Apple adding Touch ID on the MacBook, Magic Mouse and Magic Trackpad has yet to happen.

Apple may remove the 3.5mm headphone jack on the iPhone 7 and iPhone 7 Plus in favor of an all-in-one Lightning connector, possibly helping the smartphones achieve between 6.0mm and 6.5mm thinness and a waterproof design. The devices may also have a faster TSMC-built A10 chip and non-metallic casing with hidden antenna bands.

iPhone 7 Plus could have 3GB of RAM, 256GB storage and a larger 3,100 mAh battery.

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Tags: apple.club.tw, 3D Touch, backlight assembly
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Leaked ‘iPhone 7’ Display Backlight Shows Moved 3D Touch and Flex Cables

‘iPhone 7’ Waterproof Rumors Persist Amid Claims of Hidden Antenna Bands

Catcher Technology will remain the largest chassis supplier for the upcoming line of next-generation iPhones, tentatively referred to as the „iPhone 7,“ according to the China-based Commercial Times (via DigiTimes). Sources noted that Catcher’s non-Apple clients, representing about 40 percent of its overall sales, will keep it going until the majority of its output begins with the manufacturing of the iPhone 7 later in 2016. In total, Catcher Technology’s manufacturing supply is estimated to account for 30 to 35 percent of the shipment numbers for the iPhone 7.

iPhone 7 concept mock-up by designer Martin Hajek

The report also mentioned the continuing rumor that the iPhone 7 may be a completely waterproof device, building on the recent momentum that the iPhone 6s and iPhone 6s Plus had this year that showed improved water resistance. The Commercial Times also spoke of „new compound materials“ that would be put in place to form a discreet housing for the iPhone 7’s antenna, suggesting the possible removal of the bands from the back of the current iPhone generation.

As a non S-generation year, the iPhone 7 is expected to be a big step-up from the iPhone 6s and 6s Plus, in terms of design and functionality, when it launches next year. Besides a waterproof design and now the possibility of a hidden antenna band, another rumor suggested Apple could be phasing out the 3.5mm headphone jack for an all-in-one Lightning connector port.

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‘iPhone 7’ Waterproof Rumors Persist Amid Claims of Hidden Antenna Bands

Will Apple alienate iPhone fans by ditching the headphone jack?

Apple has famously killed popular technologies when it believes they’re past their best — and it could be gearing up to kill one more. According to recent rumors, next year’s iPhone 7 will ship without the 3.5mm headphone jack in favor of a thinner form factor. Understandably, a lot of fans are unhappy about that […]

(via Cult of Mac – Tech and culture through an Apple lens)


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Will Apple alienate iPhone fans by ditching the headphone jack?

Apple may give Samsung the boot for iPhone 7 chip orders

After the “chipgate” event of the iPhone 6s — in which Samsung-manufactured A9 processors were rumored to perform worse than those built by Taiwan Semiconductor Manufacturing Company (TSMC) — a new report suggests that Apple may give its South Korean frenemy the boot, and award 100 percent of its iPhone 7 A10 chip orders to TSMC. […]

(via Cult of Mac – Tech and culture through an Apple lens)


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Apple may give Samsung the boot for iPhone 7 chip orders

Jobs would’ve despised this BlackBerry-inspired iPhone concept

The Apple-watching world just about blew a gasket when the Apple Pencil was first announced for the iPad, given Steve Jobs’ famous assessment that, “If you see a stylus, [Apple engineers] blew it!” With that in mind, how would people react if the next iPhone went again Jobs’ wishes by taking a note out of BlackBerry’s […]

(via Cult of Mac – Tech and culture through an Apple lens)


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Jobs would’ve despised this BlackBerry-inspired iPhone concept